Ceramic bond diamond polishing pad, as the transitional bond between metal bond and resin bond polishing pads, it will remove metal bond scratches quicker than traditional hybrid series polishing pads, and will not increase temperature during grinding concrete flooring.
Unique design of working surface, rapid heat dissipation, and easy chip removal. Mainly used for surface or edge trimming and grinding of hard materials such as stone, concrete, aluminum alloy, etc.